Used ASM Hummingbird #9047420 for sale

ASM Hummingbird is an automated wafer bonding equipment designed for semiconductor applications in the microelectronics industry. It is a fully-automated machine comprised of an intelligent controller, an industrial servo-driven system, and an integrated bonding head. The intelligent controller is the main part of the unit which features numerous integrated sensors and feedback loops that allow the machine to optimize the bonding process. It also facilitate remote control and diagnostics via an Ethernet interface for easy operation and trouble-shooting. The machine also provides precise motion control via a combination of brushless servomotors and precision encoders for repeatable results. The integrated bonding head is a specialized tool used to connect two surfaces together using a variety of materials. The head has a robust clamping arm which securely holds the substrates in place during bond formation, as well as a heating element which can be adjusted for precise temperature control. The tool is also capable of varying both contact force and speed for maximum bonding efficiency. Hummingbird asset is designed to perform a wide variety of wafer bonding operations, including die to substrates as well as stacking of substrates. The model is compatible with existing semiconductor materials and processes, including photolithography, CMP, electrochemical deposition, and bumping. It is also capable of operating in a wide variety of environmental conditions with minimal calibration requirements. In addition to its reliable performance, ASM Hummingbird is also compact, lightweight, and easy to use. It's intuitive user interface allows for minimal setup time as well as providing the user with real-time equipment status and feedback which can be saved for later review. As such, it is an excellent choice for those looking for an automated bonding system without sacrificing performance or precision.