Used ASM Hummingbird #9373263 for sale
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ASM Hummingbird is a state-of-the-art wafer bonder, designed for fast and precise bonding of micro-structured components. This equipment is suitable for a wide range of applications, providing flexibility, reliability and high yields in production environments. Hummingbird is a fully automated device, with a small footprint and modular design. It comprises of an advanced technique for wafer handling process, and a bonding chamber with optimal temperature and pressure controls. The system is designed to ensure fast and accurate application of the bonding layers, ensuring the lowest possible thermodynamic stress levels. ASM Hummingbird uses precision linear and rotary actuators for precise positioning of the bonded area with high accuracy. The ablation unit incorporated allows for precise alignment and uniform pressure to ensure optimal adhesion of the bonding layers. Additionally, the machine is equipped with an integrated microscope and high-precision vision tool for high-resolution alignment images. Hummingbird includes an advanced real-time process monitoring asset to accurately monitor and control the whole bonding process. It provides detailed information on both the process data and the status of the devices connected to the model. Moreover, the equipment also supports various bonding techniques, such as conventional heat, infrared heating, contact thermal cleaving and ultrasonic bonding. ASM Hummingbird helps minimize process cycle times and save labor expenses, by significantly reducing manual operations. This makes the process faster, easier and more reliable, while offering superior yields. Hummingbird is also cost effective and easy to maintain, providing a highly cost competitive solution for production environments. ASM Hummingbird is a must have device for any production environment that requires the application of precise bonds for micro-structured components. It is useful for industries such as microelectronics, medical devices, and automotive components, where precise and consistent bonding is essential. The system is designed to maximize the production process, providing reliable and high yield bonding for successful product manufacturing.
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