Used ASM iHawk-02 #293671821 for sale

ASM iHawk-02 is a fully automated, high-speed bonder designed to provide quality to a range of applications. IHawk-02 can accurately place and weld components within a tight tolerance range of ±1 μm, resulting in efficient and reliable bonding performance. ASM iHawk-02 offers a wide range of features including on-the-fly bonding, high-speed thermal imaging, high-grade control of temperature and velocity, and an onboard programmable controller. IHawk-02 also offers multiple reflow and non-reflow bonding capabilities, allowing the machine to handle a variety of types of substrates. ASM iHawk-02 utilizes a range of processes including laser imaging, ultrasonic bonding, and heated tip soldering. The laser imaging equipment ensures precise alignment of the components during the bonding process, allowing for repeatable and consistent bonds. The ultrasonic bonding process applies sound waves to each substrate, creating friction which results in a strong physical bond. Additionally, the heated tip soldering process is used when a more permanent bond is desired, allowing for uniform heat transfer and low temperature penetration into the substrate. IHawk-02 also employs an advanced control system, which provides detailed feedback to the user on process parameters, process progress, and overall bond quality. This ensures that bonds are formed quickly and effectively, allowing for a high deposit rate and minimal reflow. The unit also monitors temperature, ensuring optimal bonding results and eliminating the risk of undesired heat expansion. Overall, ASM iHawk-02 is an advanced and reliable bonder designed to provide precise and efficient bonding operations. Its advanced control machine and on-the-fly bonding capabilities make it an ideal solution for a range of applications, from electronics assembly to the aerospace industry. With its ability to accurately and quickly bond components of different materials, size and thickness, iHawk-02 is the perfect solution for high-volume manufacturing.