Used ASM iHawk V #9276607 for sale

Manufacturer
ASM
Model
iHawk V
ID: 9276607
Wire bonder.
ASM iHawk V is a next generation bonder from the popular ASM-iHawk series. It is a multi-level machine that provides a powerful, flexible and efficient solution for the user when performing a variety of tasks, such as those related to chip bonding and packaging. The machine is designed with precision and accuracy in mind. The drill head is equipped with an advanced servo electric mechanism that allows for precise motion and control over a large range of motion. The microscope stage is also equipped with an advanced servo equipment that provides operators with precise, accurate control of the scanning movement over a large area. The motors and pumps are modular and can be configured to meet the needs of various applications. IHawk V has several options available, such as a C-Wire Laser light source, a high-speed soldering robot and an x-ray inspection system. The C-wire laser light source provides the user with the capability to perform high-precision processes, such as cutting and routing. The high-speed soldering robot allows for fast and efficient connection of components within a given package. The x-ray inspection unit facilitates quality control and allows operators to detect errors in the machine quickly and efficiently. ASM iHawk V is capable of producing high-quality products, with a high degree of accuracy, while also remaining cost-effective. It is designed with an enhanced user-friendly interface that allows for easy navigation and configuration of the machine. The software and hardware of the tool are reliable and provide users with a comprehensive solution for device production. The machine also has reliability testing capability that helps ensure it is properly adjusted for optimum performance. IHawk V is easy to install and setup, reducing downtime for the user. It is also flexible, allowing for configuration of the asset to meet the current needs. Overall, ASM iHawk V provides users with a versatile and efficient solution for their chip bonding and packaging needs.
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