Used ASM iHawk V #9364790 for sale

Manufacturer
ASM
Model
iHawk V
ID: 9364790
Vintage: 2010
Wire bonder 2010 vintage.
ASM iHawk V is an advanced bonding equipment used for fine-pitch flip chip assembly. It is a fully automated, advanced bonding system which is compliant with the latest and most stringent product standards for optimal results. The unit is designed for fine-pitch flip chip, as well as ball grid array (BGA), chip scale packages (CSPs), wafers, and die attach applications. It offers high-speed and high-accuracy performance with operational flexibility and reliability. The machine uses a two-head rotary process allowing simultaneous applications of flux and solder to both sides of the package, with linear feeder and dispenser units that reduces the process time. It also features a vision-guided real-time inspection of the solder joint quality during the bonding process which helps reduce downtime, as well as automated cleaning and unloading processes that include integrated barcode and serialization features. The tool has been advertised to deliver ultra-reliable results with minimization of process cycle times. It has a multi-axis inspection asset that is based on its own 5-Axis kinematic architecture, allowing it to inspect packages such as CSPs at almost zero deflection. The 3+1 VarioSnug technology provides 3D noncontact position detection for CSPs, ensuring improved reliability and yields. IHawk V also features a patented Closed-Loop process control model which significantly reduces process failure rates and optimizes the reflow and assembly of components. In addition, as the equipment is designed using an open architecture, it offers users the ability to upgrade or customize various parts of the system. It also comes with a user-friendly graphical interface on an as-needed basis with real-time monitoring of the unit status to optimize processes and to ensure compliance with quality and safety standards. Overall, ASM iHawk V offers advanced and reliable features, providing users with an efficient and cost effective method for fine pitch flip chip assembly. It is tailored towards suitability with medium and large scale production processes and is used in a variety of manufacturing applications.
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