Used ASM iHawk V #9380530 for sale

ASM iHawk V is a state-of-the-art robotic bonder designed for testing the mechanical connections and integrity of a wide range of substrates including copper, brass, aluminum, steel and titanium. This versatile equipment features an automated vision system, five-axis motion control unit and international standard communications for integration into a fully automated process. Designed for versatility and ease of programming, iHawk V bonder provides a robust platform for all your bonding needs across a wide range of substrate material, sizes and shapes. The axis machine is designed to enable a range of X, Y, and Z motions for precise placement of bonder heads to substrates. Possibilities for operations involve gap bridging, interconnect, and bridge foreign objects. The five-axis motion control allows for flexible positioning of the bonder head. Additionally, ASM iHawk V presents an alternate camera-based vision tool which lets the bonder automatically search for the feature and retrieve feature data from the images. This means no more manual programming for setting up new jobs and allows for a much more efficient production process. The bonder also supports international standard communications for integration into automated processes. This includes CAN, EtherCAT, and other popular protocols, allowing the bonder to be seamlessly incorporated with other devices and components in the asset. In addition to its versatile performance and various other features, iHawk V bonder is also designed for safety. Safety mechanisms in the machine include light curtains, soft guards, and an emergency stop button. These features are designed to deliver a safe operating environment for the operator when handling hazardous materials. In conclusion, ASM iHawk V bonder is a versatile robotic bonder with a range of features designed to make it a valuable part of any production process. With the automated vision model, five-axis motion control, and international standard communications for integration into automated processes make it a valuable asset for anyone needing to test and trust the connections of a wide range of substrates.