Used ASM iHawk Xtreme #293623147 for sale

ASM iHawk Xtreme is a high speed automated wedge bonder designed for advanced packaging and die attach applications. It offers high throughput, ease of operation and flexibility for a wide range of applications. ASM IHAWK-XTREME is a fully automated equipment with an intuitive, user-friendly graphical user interface (GUI) that minimizes operator training time and maximizes production efficiency. The iHawk die attach system is specifically designed to handle the most advanced semiconductor packages and features an advanced vision unit for precise placement and alignment. The machine includes a large, 11" Xtreme X-Y stage for precise positioning of both die and packages, as well as a quick-change die mount for convenient die exchange. With its integrated vision machine, I HAWK XTREME provides highly accurate die alignment and visual feedback of process quality. In addition, the tool is fully compliant with industry standards such as IPC/JEDEC, allowing it to be integrated into a high- volume production environment. The asset also features an advanced closed-loop control model that tracks bond conditions in real-time and automatically adjusts parameters to maintain precise bond control. The monitor window gives operators feedback on key process information such as bond force, temperature and number of bonds made per hour. It also provides quick access to bond recipes, allowing operators to quickly upload the desired process parameters. ASM I HAWK XTREME is a highly precise, reliable and safe equipment with advanced automation and monitoring features to ensure repeatable and consistent results. The system offers superior accuracy with a repeatability of +/- 1 µm, as well as unprecedented bond reliability achieved through integrated process control. The unit also includes a number of safety features, including thermal feedback that allows operators to monitor heat status in the machine, as well as an Emergency Stop button for quick shut down in case of any process failures. IHAWK-XTREME is an excellent choice for die attach and advanced semiconductor packaging applications. It is an advanced, accurate and reliable tool designed to provide precise bond results and minimize downtime. The intuitive user interface makes it easy to operate and maintain, while the included safety features ensure process integrity and high throughput.