Used ASM iHawk Xtreme #293635923 for sale

ASM iHawk Xtreme is a state-of-the-art bonder specifically designed for high-end packaging requirements, like fine-pitch copper bonding and die attach. It is a versatile and cost-effective solution that has the ability to change and adjust based on the requirements of the application. This equipment uses a unique "floating" jig that can be quickly and accurately repositioned to perform various tasks. It has a very small footprint, which is ideal for those that need a large amount of space. The system has a high speed bond head, with a cube-scan, and can handle up to 10 different types of bonds. Additionally, the unit has powerful software to supports automation and allow for easy programming of complex jobs. The machine is flexible and has many features, like bond run analysis and stress strain analysis. The software also has support for bond heads, filler materials, and predictive maintenance diagnostics. Furthermore, the tool has process flexibility options, with use of different materials, such as Cu-Au, Ni-Au, InGaAs, and CuP. The asset also has the ability to bond chips down to 15 microns and up to 160 mm square. It is capable of achieving a posture of total accuracy with a 3-point adjustment capability to ensure trace and space accuracy. The model includes an automatic device release/re-connect equipment to ensure high yields and a consistent process. Additionally, it comes with a vacuum seal station, which is necessary for cleaning and waxing prior to bonding. ASM IHAWK-XTREME has a number of features and capabilities that will enable users to take advantage of the most advanced and demanding packaging processes for their electronics and/or micro-electronics applications. Its robust and versatile design and easy-to-use software make it an ideal choice for those that need a reliable and effective bonder.