Used ASM iHawk Xtreme #293651163 for sale

ASM iHawk Xtreme is an integrated bonding equipment designed for high-performance applications, especially in the area of microelectronics. It is capable of providing an accurate, safe and repeatable bonding solution using either parallel or robotic systems. ASM IHAWK-XTREME offers users a wide range of features that enable precise bonding with minimal operator intervention. I HAWK XTREME utilizes advanced vision and control systems to accurately bond and control parts. The integrated control system provides a variety of feedback and will adjust the bond parameters automatically in order to ensure consistent and repeatable results. The unit can be configured to bond on either flat or curved surfaces, at a variety of temperatures, and with different types of bond materials. The machine can even accommodate different bond lengths and widths. In addition to providing precise bonding capabilities, IHAWK-XTREME has been designed to be efficient and safe, with integrated safety systems that will protect the tool from any potential accident or malfunction. These safeguards help to keep not just the asset safe but also any personnel present in the area. The model also boasts an intuitive touchscreen user interface that allows for easy navigation and monitoring of the equipment. The system is highly configurable and can be tailored to meet the specific requirements of almost any application. It can be setup to bond multiple parts simultaneously or can be used to bond single parts. It is also adaptable and can be used with a variety of different cathode materials, allowing for a customized bonding process based on the materials being used. Combining all of these features, ASM I HAWK XTREME is a versatile, efficient and safe integrated bonding unit. It offers precise control, repeatable results and numerous safety features that ensure the machine stays in top condition and keeps personnel safe. The tool can be tailored to meet the exact requirements of almost any application and provides an easy to use touchscreen interface. All of this results in an advanced bonding asset suitable for a range of microelectronic applications.