Used ASM iHawk Xtreme #9144018 for sale

ASM iHawk Xtreme is a high-performance bonder designed for semiconductor wafer bonding, especially for demanding joining requirements. This device is equipped with automated processes, comprehensive parameterization features, and integrated safety features. It is an optimal solution for wafer applications requiring high throughput with consistent results. ASM IHAWK-XTREME is a user-friendly device that allows for easy setup and compatibility with all types of semiconductor wafers. This bonder is accepted by leading semiconductor manufacturers and is widely used in the fabrication of advanced integrated circuits. The device is equipped with advanced process monitoring and diagnostic capabilities that enable users to achieve reproducible process performance and protect their tool, parts and components. Through advanced process profiling and real-time process control, I HAWK XTREME can be utilized in production environments that require high-reliability bonding processes. IHawk Xtreme houses an in-process wafer size recognition system that accurately defines the wafer surface and identifies potential bonding issues before they occur. This reliable bonder also features an automated robot arm system which can handle up to 7 wafers at a time, and supports wafer sizes from 200mm to 300mm. The device is equipped with energy analysis and contouring capability so that it can easily accommodate different applications and parameters. The energy profile can be customized in order to achieve varying levels of bond energy on different bonds. This feature allows users to control the strength of each bond and optimize the bonding process. ASM I HAWK XTREME includes a patented pricking sensor which ensures precise nibbling of mold release gates to reduce wafer cracking and maintain process quality. It also eliminates any potential scratches on the wafers that might lead to processing problems. The device also houses 4 working points, equipped with linear motion actuators which allow the bonder to increase its productivity and reduce the risk of handling errors during production. The bonder is designed to be a completely modular machine with a wide selection of components and parts. This makes for easy maintenance, repair, and upgrade. It also supports traceability with its in-depth logging feature that can record the entire process execution and all records of each wafer bond. Finally, IHAWK-XTREME is built to adhere to strict safety and environmental standards. With an ETL-certified safety infrastructure, it ensures that safety guidelines are met at all times to keep operators safe during operations.