Used ASM iHawk Xtreme #9156298 for sale

ASM iHawk Xtreme is a high performance bonder designed for efficient, high accuracy and high volume bonding of a variety of substrates. It is designed for applications such as the assembly of displays, device integration, chip on board and PCB joining. The bonder is equipped with a scanning Laser equipment and a Closed Loop piezo-electric actuator which efficiently controls the z-axis to ensure accurate control of bond position and repeatability. The bonder features an advanced 5-axis control system, that not only accurately positions the bond head but also ensures accuracy when bonding and allows the user to set the Z-axis position, pitch and roll and yaw. The 5-axis control unit on the bonder is equipped with a high resolution opto-encoder feedback, which ensures that the bond head remains precisely positioned during production and allows for fast reaction with low inertia. ASM IHAWK-XTREME bonder is also equipped with a 17-stage camber alignment and profile mapping feature, which allows for precise control of the bonding parameters and allows for finely tuned and repeatable bonds. This feature also provides the capability to carry out complex profiles with accuracy and repeatability. The bonder comes with a workspace of 406 x 406mm, this gives a processing capacity of more than 18,000 nodes per hour and enables the user to work on a wide range of devices with multiple positions. The bonder also comes with a smart chip recognition, allowing the user to identify the electronics components and to quickly and accurately align and position the bond head before the start of production. The bonder has a heated chuck head with a range of temperatures and cooling options, that enable the user to produce bonds at different temperatures. The heated chuck head provides the ideal conditions to produce accurate bonds and helps prevent damage to the bonding material during production. The bonder is also equipped with a built-in temperature controller, which provides consistent temperatures to ensure uniform bonds are produced. I HAWK XTREME bonder is a high performance tool that provides accurate, repeatable and high volume bonding of a wide variety of substrates. The bonder is ideal for applications such as the assembly of displays, device integration, chip on board and PCB joining and is equipped with a high performance 5-axis control machine and advanced camber alignment and profile mapping for precise control of the bonding parameters. The built-in temperature controller ensures consistent temperatures and the heated chuck head ensures accurate and uniform bonds.