Used ASM iHawk Xtreme #9305260 for sale

ASM iHawk Xtreme is an advanced automated bonder equipment designed to reduce the complexity of bonding processes for modern electronics assembly. It is designed to meet the most stringent accuracy and reliability requirements, enabling it to be used in aerospace, medical and semiconductor production applications. ASM IHAWK-XTREME features an innovative modular design and a comprehensive bonding management system that can process various types of bonding processes, including thermocompression bonding, eutectic bonding, ultrasonic bonding, laser processing, hot wire bonding, and surface-mount components (SMD) bonding, among others. This wide range of capabilities makes I HAWK XTREME bonder a perfect solution for complex assembly applications. The bonder is equipped with a multi-functional high-speed imaging unit and 2D vision control machine. The imaging tool is capable of capturing high-resolution images of delicate components with up to 5 megapixels of resolution for precise positioning and positioning control. These tools ensure precise placement of components during bonding processes. The asset is also designed with a unique motion control technology and closed-loop feedback control model. This advanced technology enables the bonder to accurately adjust its speed and position during production processes. The motion control equipment provides accurate, real-time motion control programming, eliminating the need for manual programming and eliminating errors. The system is designed with an intuitive user interface that enables operators to easily input bonding parameters, allowing them to keep track of all of the tasks and provide flexibility and accuracy when controlling the unit from a PC. The bonder also features a robust barcode scanning machine, allowing it to quickly identify components and streamline the production process. This tool reduces the risk of human errors while helping operators keep track of their processes and save time. In sum, IHAWK-XTREME is an advanced bonder asset that offers a versatile and reliable bonding solution for the most sophisticated production processes. The model features a wide range of capabilities, including thermocompression bonding, eutectic bonding, ultrasonic bonding, laser processing, hot wire bonding, and surface-mount components (SMD) bonding. In addition, it features a multi-functional high-speed imaging equipment, closed-loop feedback control system, intuitive user interface, and barcode scanning capabilities. All of these features combine to create an efficient and reliable bonding solution for modern electronics assembly.