Used ASM iHawk #293671819 for sale

Manufacturer
ASM
Model
iHawk
ID: 293671819
Vintage: 2009
Wire bonder Wire diameter: 0.8-1.5 mil 2009 vintage.
ASM iHawk is an advanced low-temperature, low-pressure die attach process technology. It is a fully automated, integrated equipment that offers high-precision bonding and die placement capabilities. ASM I HAWK incorporates advanced physical vapor deposition technologies and advanced vision-based systems to achieve a high level of accuracy and reliability. IHawk is designed for die attach and component attach applications, providing high-yield, low-cost manufacturing with near-uniform detachment and bonding capabilities across various materials. This allows for repeatable, reliable and cost-effective production and process cycles. I HAWK utilizes advanced Low Kelvin Pulsed Laser Annealing (PKLA) technologies to enable precise, distortion-free bonding with precise adjustments to be made during the process. It can bond to a wide range of substrates including aluminum, stainless steel, titanium and copper. ASM iHawk utilizes a rotary table format, and includes a load lock enclosure to minimize particle contamination and improve humidity control of the bonded area. ASM I HAWK also incorporates a vision system and feedback control unit to ensure parts are located and aligned precisely and repeatably, enabling a quick and accurate die attach process. In addition, iHawk integrates several unique technologies including a built-in dual acoustic geometry measurement machine that ensures a uniform and consistent bond process and a real-time part tracker that allows for tracking of bond locations and a detailed analysis of the process. This real-time tracking and analysis features provide full traceability for processes that require it. I HAWK is a low-temperature, low-pressure die attach platform that provides excellent accuracy and reliability. It is ideal for high-yield, low-cost die attach applications that require precise die placement and uniform detachment. The advanced features and integrated technologies ensure a reliable bond process and traceability of the product, making it an ideal solution for a variety of high-quality manufacturing requirements.
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