Used ASM iHawk #9096069 for sale

ASM iHawk is an advanced bonded semiconductor processing system. It utilizes a unique, proprietary ASIC-based microprocessor architecture integrated with advanced MEMS and Nano-technology. This combination of technologies allows the machine to offer advanced process capability, ultra-high-speed throughput, and precision control. The iHawks' chip bonding process uses a combination of motion control, nano-laser heating, and electrical pulse applications to securely bond dies to one another, to a printed circuit board, or to any other substrate. It is optimized to work with a wide variety of standard and custom chips. The machine is capable of handling the entire bonding process from start to finish, from pick-and-place die loading, through die mounting and bonding, to finally encapsulation. The system is designed for zero-downtime operation, making it ideal for high-speed production of semiconductor packages. The machine is fault-tolerant and designed for ultra-reliable performance. It offers fully programmable accuracy, as well as a wide range of temperature, pressure, and speed control. It also features an advanced feedback mechanism to enable efficient process monitoring and adjustment. The system is easy to use, facilitating rapid setup and changeover. The user interface allows operators to monitor real-time process parameters and quickly change settings as total process times are reduced. Additionally, the machine can be fully integrated with existing ERP, scheduling, and other systems, allowing data to be collected, analyzed, and tracked, enabling ongoing improvements and ensuring quality and consistency in the production process. ASM I HAWK is an advanced bonding automation tool with numerous advantages. It offers reliable, precise processing, and ultra-high-speed throughput, making it the choice of many in the semiconductor industry. With its advanced design and exclusive thermal, electrical, and optical technology, it will continue to address the demands of the industry for more efficient and precise bonding solutions.