Used ASM iHawk #9188203 for sale

ASM iHawk is a state-of-the-art microelectronic bonder designed to provide reliable interconnection for high-performance components. This versatile equipment facilitates advanced wirebonding of a new generation of advanced semiconductor and optoelectronic devices. ASM I HAWK is a highly controllable, automated production bonder. It is ideal for applications requiring precise placement and minimal deformations. The system features Capacitance-to-Ground (CTG) technology that provides the necessary current flow to the bond head and accuracy in the placement of the bond-wire. This feature helps to achieve high quality, consistent soldering results, which are necessary for reliability in today's assemblies. The unit also utilizes advanced high-precision feed-head assembly for fast and accurate placement of high-performance wires. The advanced low-force ultra-sonic wedge bond head technology is engineered to produce high quality bonds with minimal damage to the components during the bonding process. IHawk is highly flexible and provides easy reconfiguration of the bond head to support a variety of wire sizes, shapes, and types. The user can easily adjust the bonds geometry with a comprehensive graphical user interface (GUI). The interface can also be used to configure parameters such as bond force, bond time, and wire speed. The machine also utilizes several advanced software packages and has the capability to generate detailed reports that aids in production process and product quality control. With its powerful data management tool, I HAWK can be interfaced with other systems, such as circuit-test machines, Barco-blend machines, and bare-die pick-and-place machines, to enable an integrated production process. ASM iHawk has a strong and lightweight platform design, making it suitable for space-constrained production lines. It also features modular components, allowing the user to easily customize the bonder according to their application requirements. ASM I HAWK provides a complete solution for producing robust and reliable interconnections between high performance components. The asset is perfect for a wide range of applications and users, such as semi-conductor, optoelectronic and optoelectronic systems manufacturers, automotive, telecommunications, and aerospace industries.