Used ASM iHawk #9188204 for sale

Manufacturer
ASM
Model
iHawk
ID: 9188204
Vintage: 2011
Wire bonder 2011 vintage.
ASM iHawk is a bonder manufactured by ASM Companies. It is an advanced, high-speed bonder used in the assembly and manufacturing of electronic components. The equipment is comprised of two heads - The iHawk12 and iHawk24 - which both feature a built-in vision system, integrated pulse generator, precision-controlled bond head movement, and advanced bond force measurement technology. This combination allows for both accurate and repeatable bonding of a variety of components, including chip packages, lead frames, flat cables, and chip on board (COB) assemblies. The iHawk12 is designed for high-speed placement of components up to 12 mm in size, while the iHawk24 is capable of placement of components up to 24 mm in size. Each unit utilizes an X,Y, Theta bond head, which is able to position component packages accurately within 0.1mm, and is capable of high accuracy bond placement and alignment on substrates. ASM I HAWK's built-in vision machine allows for optimized placement and bonding of components with a high level of accuracy. In addition, the tool's vision asset enables alignment and repeatability of the bond process. It is also equipped with a pulse generator, which is able to control the bond energy applied, pulse width, and pulse waveform during the bonding process. This ensures that the bonding process is controlled and error free. The integrated force measurement model of iHawk ensures that each and every bond produced is of a consistent and reliable quality. This measurement equipment also aids in providing precise repeatability of the bond's characteristics including bond strength, and also aids in lowering the failure rate of the components. Overall, I HAWK is a powerful bonder that provides reliable bonding of various electronic components. Its advanced vision system, integrated force measurement unit, and precision-controlled bond head movement all contribute to its ability to produce reliable and consistent bonds in a fast and accurate manner.
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