Used ASM iHawk #9201093 for sale

ASM iHawk is an automated bonder equipment used in the production of cell-based implants. It is capable of high-speed and precision bonding of tissue layers with small component parts. ASM I HAWK works in an automated, continuous motion, bonding device as small as 1 millimeter in thickness. It is designed to create a uniform layer of components, and features high speed medical grade bonding that meets Microelectromechanical Systems (MEMS) industry standards. IHawk is a benchtop machine, based on a thermosonic ball bumps system. This ball bonding unit entails rotating a ball of solder across a specially designed fiducial surface, which heats and melts the solder, bonding the two components together. The use of the fiducial surface ensures that the two components are properly aligned, and that the accuracy of the bonded interface is optimized. The ball bumps bonder features an integrated video microscope which, along with a Micro Imaging Machine, enables users to monitor the work surface and visualize the bond formation. Additionally, the tool is capable of recording the process in order to use it for research and development purposes. An optical microscope also allows for the observation of the bonded components. I HAWK bonder utilizes a triangle loop heater that is powered by a 25V motor. This motor is capable of delivering up to 25W to the bonder, ensuring efficient and repeatable heating cycles. The asset also provides various preset programs for different processes, and the ability to customize up to nine programs for versatile and specific applications. The selectable temperature ranges allow operators to optimize bond strength and reproduce bonded joints. ASM iHawk features a two-level control model and a diagnostic equipment with feedback from bond parameters. This allows for traceability of the process, and improved quality control over the production process. In conclusion, ASM I HAWK is an automated and extremely accurate benchtop thermosonic ball bump bonding system, that can be used for research, development and production of medical implant components. It provides users with fast and reliable bonding, as well as the ability to monitor the process through high-strength microscopes. The optimized temperature ranges and two-level control unit guarantee high repeatability and quality control.