Used ASM iHawk #9377603 for sale

ASM iHawk is a bonder designed for complex bonding applications in the semiconductor industry. It is a low volume thermocompression bonding machine capable of producing small, precise, reliable, and repeatable bond connections. ASM I HAWK utilizes state-of-the-art technology and features modular process capability, unique planarized bond head design, and laser activated chamber technology. IHawk's modular process capability allows it to perform multiple types of bond processes such as thermocompression, thermosonic, ballbonding and wedge bonding. The modular capability also permits the machine to perform different types of process steps concurrently, thereby reducing the total manufacturing time. The planarized bond heads provide superior bond connections by minimizing the thermal stress effects on the bond pad. The Heads are also able to replicate bond processes across multiple wafers guaranteeing consistent, repeatable results. In addition, the Heads are capable of reaching very high temperatures quickly and accurately, facilitating rapid die attach processes. The laser activated chamber technology further enables I HAWK to optimize the bond process settings for real time process control. The laser activates the gas pressure, time, and temperature during the bonding process, allowing for more precise results. The laser also monitors the resistivity changes during the process, enabling the machine to detect any failures that occur due to an improper bond. ASM iHawk is the ideal solution for complex bonding processes on a variety of platforms. Its combination of superior bonding performance, quality, and reliability make it a preferred choice for semiconductor manufacturers who require the highest level of bond integrity. ASM I HAWK enables improved production yields, cost-effective solutions, and minimal downtime, resulting in a more efficient and reliable manufacturing process.