Used ASM iHawk #9384509 for sale

ASM iHawk is a state-of-the-art infrared bonder, designed for rapid and precise wire bonding of semiconductors. It is capable of ultraspeed single-point thermosonic and gold ball bonding, as well as standard aluminum wedge and thermocompression bonding. The equipment is designed to be adaptable, so it can be used for different applications including die attach, hybrid circuit assemblies, and photovoltaic and automotive applications. ASM I HAWK features a powerful, virtual machine environment that is highly customizable and easy to operate. This environment enables the user to access stored process recipes, adjust or create new recipes, and visualize all aspects of the process. The system provides automatic wire length adjustment, wire feeder alignment, high accuracy visual servoing, and many other features which allow high yields and short cycle times. IHawk utilizes an efficient, dynamic Wire Transfer Unit (WTS). This machine uses an Olympus camera and optical recognition to identify the bonding wire, locate fiducials, perform positional alignment, and thoroughly control the wire path. This tool provides quick, below 2-micron capability for repeatable bonds. The WTS also offers built-in mechanisms for monitoring the wire feed and detecting wire overlap. I HAWK is equipped with an Adaptik, an intuitive tool which allows the user to quickly and easily make changes to a process recipe or set up new recipes. The Adaptik integrates all the necessary elements of bonding including bonds per second, bond quality settings, time delay, and bond force. It also provides the user with handy visualizations of the process recipe, which help the user better understand the machine's parameters and understand their effect on the outcome. ASM iHawk also offers many features for ensuring a quality product, such as automated loop recognition and visualization. This feature allows for control of the wire loop to ensure that is within specified parameters. The asset also has several built-in features, such as off-axis viewing, to facilitate accurate bond placement on advanced flat panel packages. ASM I HAWK is designed to be easy to use and maintain. The user-friendly interface and intuitive features allow users to quickly set up and start bonding. The model is complemented with a full suite of support services, including remote access, real-time feedback, and an active user forum. All of these features are designed to make iHawk an ideal choice for manufacturers who need an efficient and reliable bonder for their semiconductor applications.