Used ASM iHawk #9393465 for sale

ASM iHawk is a fully automated bonder equipment designed for high accuracy bonding of die and test probes on semiconductor wafers and substrates. The system consists of a high-precision motion platform, laser-based substrate scanning and placement, and a range of bond head options, including integrated epoxy dispensing and laser trimming. The unit offers both quasi-static and dynamic bonding, as well as optional MEMS micromanipulator technologies. The machine features a dual-axis X/Y motorized stage and a motorized Z-axis for improved placement accuracy. The stage has 20-micron resolution and a total stage range of 250 mm in both directions. Additionally, the motion platform is highly rigid and thermal-isolated to keep the wafers securely in place during the bonding process. The platform also features a high-precision touch sensor for advanced process monitoring. The tool also features a laser-based substrate scanning module that provides higher accuracy and repeatability compared to vision-based solutions. The laser-based module utilizes the latest in MEMS positioning technology and features two layers of sensing with a total resolution as fine as 1 micron. It also scans up to five different substrates at once, allowing for fast substrate processing. ASM I HAWK bonder also features a range of bond head options, including integrated epoxy dispensing for non-volatile bonding of delicate components and laser trimming for complete control over the bonding process. The asset also features a range of other options, including an optional microscope for alignment and process monitoring. Furthermore, the bonder is equipped with an intuitive, real-time operator interface for intuitive control over the entire model. Overall, IHawk is a fully automated, high-accuracy bonder equipment designed for high precision bonding of die and test probes. The system includes a range of features, including a high-precision motion platform, laser-based substrate scanning and placement, and a range of bond head options. Additionally, the unit offers both quasi-static and dynamic bonding, as well as optional MEMS micromanipulator technologies for comprehensive process control.