Used ASM iHawk #9402842 for sale

Manufacturer
ASM
Model
iHawk
ID: 9402842
Wire bonder.
ASM iHawk is a bonder that combines bonding and handling into one precise, cost-effective solution. ASM I HAWK is driven by an intelligent controller, located on the equipment, that ensures precise handling and precise bonding. It is equipped with a built-in vision system with dual cameras and several sensing technologies, such as force and temperature, that enable precise handling and precise motion control. Additionally, the bonder is designed to create repeatable processes, making it suitable for multi-shift operations. IHawk can accommodate a wide range of substrates and components, including flat substrate panels in sizes up to 500x400mm, single- and double-sided circuit boards, and various components, including connectors, resistors, transistors, and more. The bonder boom is equipped with a high-precision micro-motor and a pneumatic suction unit that can generate up to 1376N of suction force. This allows I HAWK to bond a variety of materials, including epoxy, rubbers, and elastomers. The bonder also has a range of advanced bonding options, including laser welding, infrared welding, optical inspection, traceability, and more. It is capable of producing high-quality, high-yield bonding results with minimal operator interference. ASM iHawk is also designed for safety, featuring a safety cover that ensures maximum protection for the operator and environment. In addition, its automated software interface allows operators to customize the process settings for different applications. The user interface is greatly enhanced by a 7" color screen, allowing operators to view and adjust the settings quickly and conveniently. Operators can also choose from a variety of optional extras to meet their specific requirements, including a conveyor machine and anion generator. In conclusion, ASM I HAWK is an advanced, reliable bonder that offers high-quality bonding results with minimal operator interference. It is an ideal solution for cost-effective and precise handling and bonding of a variety of substrates and components.
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