Used ASM IS868LA #9119587 for sale

ASM IS868LA, developed by ASM International, is a semiconductor bonder designed for use in high volume laboratory and production environments. IS868LA features a modular, robust construct which allows it to be configured to suit a variety of requirements. The bonder is designed to be a cost-effective solution to the challenges of producing high quality, reliable connections between electronic components of a circuit. ASM IS868LA can bond up to 24,000 connections per hour and up to 2,400 connections simultaneously. The bonder is equipped with two independent axes and two IR cameras for precision alignment and positioning of connections. This ensures that each connection is consistent and reliable, as well as maximum throughput. IS868LA's modular design also allows it to be easily integrated into existing production lines, and its adjustable force feedback system allows for quick and easy adjustment of bonding force and power. ASM IS868LA is built to deliver higher throughput and increased reliability with a minimized footprint. Its intuitive user interface makes it simple for novice technicians to learn and use the bonder, and IS868LA also features Safety Interlock to provide a safe and secure working environment. The solid steel structure of ASM IS868LA provides maximum stability, which is critical for reliable bonding operations. The temperature is precisely regulated to maximize connection reliability, and the bonder is equipped with powerful aspirating and Pb free solder system which ensures clean and repeatable bonding results. IS868LA can also be equipped with a variety of compatible tools to expand its bonder capabilities. ASM IS868LA is an ideal choice for applications requiring accurate and reliable bonds in a high volume automated environment. The bonder's intuitive user interface and modular design makes it easy to configure, while its robust construction ensures reliable performance. The bonder's high performance and reliable operation ensures it is a cost-effective solution to the challenges of producing high quality, reliable bonds.