Used ASM IS868LA2 #293610606 for sale

ASM IS868LA2 is an automated die bonder designed for robust bonding of die, chips, and other small components. It features a highly specialized mounting nozzle and head designed to accurately move and position components with extreme precision. IS868LA2 is equipped with a reliable displacement sensor to accurately detect component presence, leading to improved repeatability and accuracy. The equipment also supports a range of bonding technologies, including soft and reflow, eutectic, glass frit and epoxy. ASM IS868LA2 is equipped with a highly powerful Z-axis motor and specialfeed system that are capable of a 5-micron placement accuracy. The unit also features a comprehensive touch-screen display that allows the user to easily program and monitor machine operations. In addition, the unit has a powerful image processing tool and vision asset, allowing for high-speed, high-precision scanning of component positions and shapes. This enables the model to adjust to irregularities in part position and shape, further improving repeatability and accuracy. IS868LA2 also features capabilities for workpiece recognition and component separation. This allows for rapid acquisition and handling of workpieces, eliminating the need to manually separate components. The equipment features an automatic component discarding and alignment system, which is designed to automatically feed parts and align them with precision bonding heights. This ensures consistent bonding accuracy across the entire substrate surface or component array. ASM IS868LA2 is built with an integrated substrate transport unit and automatic component and substrate loading machine. This allows the user to quickly transport and load components, reducing the need for manual handling. The tool also features a reliable component and substrate heater, which is designed to facilitate rapid heating and cooling of parts before and after bonding. This helps achieve superior bonding results with minimal component damage. IS868LA2 also provides robust safety features, including an intuitive safety interlock, manual component verification, and emergency shut-off. This allows the user to easily and safely operate the asset and provides peace of mind when using the unit. In conclusion, ASM IS868LA2 is an automated die bonder that is designed for accurate and repeatable die, chip, and component bonding. It is equipped with advanced bonding technologies, a robust Z-axis motor, an integrated substrate transport model, and a reliable vision equipment. Additionally, IS868LA2 features improved safety features with an intuitive safety interlock and automatic component and substrate loading systems.