Used ASM IS868LA2 #9394646 for sale

ASM IS868LA2
Manufacturer
ASM
Model
IS868LA2
ID: 9394646
Vintage: 2011
Die bonders 2011 vintage.
ASM IS868LA2 is a high-performance thermocompression bonder which has been designed as an ideal solution for reliable and efficient assembly of semiconductor packages and lead frame connections. This machine offers an efficient and cost-effective means of attaching bond wires to contact pads, eliminating the need for manual assembly of components. It is capable of reaching temperatures of up to 400°C in less than 2 seconds, and is capable of making connections of up to 2 microns in size. Thanks to its precise control algorithms and optical alignment system, the thermocompression bonder provides consistent and reliable connections, ensuring optimal results delivered at the end of the process. The machine is equipped with an intuitive human-machine interface (HMI) that allows for fast and user-friendly programming, reducing operator-to-machine interaction time. Additionally, the integrated closed-loop monitoring systems provides real-time feedback on the bonding process, enabling for automated corrective actions to ensure optimal adherence and robustness of the connection. IS868LA2 also comes with a vision system that guarantees precise location of the bonds, dialing in exact contact positions for the bonder. The machine offers quick cycle time, taking less than 15 seconds to reach 400°C, thus allowing for a much higher throughput than manual assembly. Additionally, it consumes significantly less energy as it only requires energy when making actual connections. This contributes to ASM IS868LA2's high performance and increases the overall productivity of the process. In addition, the thermocompression bonder provides improved accuracy, as it eliminates human error and variation that can affect the quality of the connection. IS868LA2 is an efficient and reliable thermocompression bonder that provides an effective solution for making Contact pads in the manufacture of semiconductor packages and lead frame connections. Its high-performance features and intuitive user interface provide an efficient, cost-effective and accurate method for making reliable and robust connections.
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