Used ASM IS868LA3 #293629644 for sale

ASM IS868LA3 is an open-frame ultrasonic bonding station designed for time-dependent and/or environmental/mechanically dependent production processes. It is designed for advanced production of electronic packaging for device bonding and offers a cost-effective solution for high-throughput both in the laboratory and in production. IS868LA3 features an ultrasonic bonding head powered by a high-precision piezoelectric transducer, which is capable of generating up to 2,500 W of peak power. The bonding head is mounted to a rig by means of a vaned cage and can be adjusted precisely in three dimensions to ensure optimal consistency in bond results. The bonding head is enclosed by a process chamber containing nitrogen or any other controlled atmosphere, enabling a fully-enclosed production environment under which a wide range of bonding parameters can be adjusted. ASM IS868LA3 uses a contact closure process for optimal results, which places a double sheet of sheet metal together and applies ultrasonic power to the metal sheets to form a strong adhesive bond. The 100kHz ultrasonic power supplied to the bonder ensures efficient process times, and can be adjusted based on the metal sheet material, temperature, environmental conditions and other process variables. In addition, the thermal profile of the bonding process can be monitored via the on-board thermal imaging camera, enabling the process to be adjusted to compensate for any risks of thermal damage to the sheets or components. IS868LA3 also features several safety features, such as an emergency stop button and an anti-collision sensor, which prevents the bonding head from contact with the components, assuring consistent and reliable safety operation. Furthermore, it is equipped with tempered double-glass side windows which provide the user with shielding from the powerful ultrasonic process, as well as acting as a means to maintain the controlled process chamber. ASM IS868LA3 is a powerful and reliable bonder which provides fast and consistent process results, proven performance and safety, and is an ideal instrument for metal sheet bonding and other advanced production processes such as electronic packaging for device bonding.