Used ASM IS8912DA #293819557 for sale

ASM IS8912DA is an advanced, tabletop thermosonic gold bonder for wire bonding applications. This bonder is designed to provide optoelectronic package performance for higher-reliability bond applications. Featuring a unique, active smart feedback system for controls and automated process optimization, ASM IS8912 DA ensures quick and accurate bonding. This provides the state-of-the-art precision required to produce microelectronic components with superior quality. This bonder features a smart, touch-screen display for easy automation and operation. The display allows the user to customize process parameters including temperature, bonding force, bond time, and other variables for precisely meeting desired specifications. Based on modern wire bonding technologies, IS8912DA provisions high temp shocks with dynamic force levels for precise and reliable bonding. This reliable operation is further facilitated by an automated feedback system that continually adjust to cost and performance parameters to ensure consistent bonding results. IS8912 DA is equipped with a great variety of environment-friendly safety features. Its advanced grounding and vacuum systems protect the bonder from electrical interference when it is placed within sensitive work environments. Additionally, a dual magnifying microscope with different magnifications (standard, high, and ultra-high) provides excellent view of the bonding area. This eliminates operator fatigue and further bolsters accuracy. ASM IS8912DA is designed to support the most rigorous gold ball bonding operations, and it is suitable for use in both manual and semi-automated processes. The system is also easy and convenient to set up and operate, eliminating the need for extensive programming and handling. This bonder is routinely used by industrial manufacturers and research establishments in all kinds of electronic products. With its superior quality, reliable performance and exceptional safety features, ASM IS8912 DA is a great choice for any wire bonding application.