Used ASM IS8912DA #9217468 for sale

ASM IS8912DA is an advanced semiconductor bonder designed specifically for high-speed die attach. With its advanced technology, ASM IS8912 DA enables highest possible bond quality and reliability. IS8912DA is a compact, gantry-style bonder that provides efficient die attach for a wide variety of components including Multi-Chip Module (MCM) packages, passive components, flip-chip, and ball-grid-array (BGA) packages. Its dual-arm design allows for precise indexing and reliable placement of components. With a top-speed of 10,000 velocities per second, it delivers quick and repeatable die attach. IS8912 DA's advanced design includes a highly sensitive vision equipment for precise die placement. The system features a high- resolution color optical inspection unit that is designed to maximize die attach accuracy and enable consistent yields. It also provides tolerance checks for high accuracy and faster production yield. ASM IS8912DA comes with a variety of features designed to increase process speed and maintain high reliability. Its modulated temperature support maintains a constant temperature to prevent thermal drift and other related problems, while its simple and intuitive machine controls allows for quick process changes. ASM IS8912 DA also offers both manual and automatic die sorting mode, each of which provides an optimal process control. In addition, IS8912DA is designed to greatly reduce costs by reducing tooling costs, eliminating operator errors, and minimizing manufacturing time. The bonder also features an integrated waste collection tool designed to effectively manage the debris caused by bonding operations. This feature allows for better maintenance and increased cost savings. Overall, IS8912 DA is a high-tech, high-reliability bonder designed to provide reliable and repeatable die attach for a wide variety of components. Its advanced features are designed to ensure greater accuracy and manufacturing yield, while its simple and intuitive controls enable quick process changes and improved cost savings.