Used ASM IS898DA #9315207 for sale

ASM IS898DA is a precision bonder specifically designed for wire bonding and wedge bonding processes. It is equipped with a unique multi-nozzle equipment that allows for high speed, low waste operation to maximize production yields. The system is capable of handling applications ranging from wire bonding for integrated circuits (ICs) to fine pitch gold wire bonding for hybrid components. IS898DA consists of an automated vision unit for precise alignment of wire or wedge bonds and a pressure adjustment machine for highly accurate bonding force control. The vision tool is equipped with a digital imaging asset, an automated edge position measurement model and a sophisticated color recognition equipment. This allows for accurate placement of the bonding segments and enables a high-precision micropositioning. In order to achieve the highest level of accuracy, the system uses a three-axis auto focus drive unit in combination with an auto-illumination machine, providing optimized pattern recognition and precise performance. This combined tool also helps to eliminate wire slippage during the welding process, reducing the potential for scrap and rework. The bonder is also equipped with a multi-nozzle asset which enables the operator to produce high volume wire or wedge bonds at a high speed. This feature further reduces the potential for excess waste and overspray. The multi-nozzle model is also capable of dynamically adjusting the nozzle temperature to ensure the optimum adhesion temperature is achieved for each application, leading to long lasting, dependable wire bonds. ASM IS898DA also includes a variety of optional features including a tool compensation equipment for rapid setup time, programmable operation profiles for repeatable processes, and a networking option for remote control capabilities. The optional networking feature also allows users to monitor system performance, apply process adjustments and troubleshoot errors remotely. In summary, IS898DA is an advanced and versatile bonder capable of performing wire bonding, wedge bonding, and other related processes with exceptional levels of accuracy. Its advanced multi-nozzle unit, precise auto focus drive machine, and adjustable bonding force control combine to provide an extremely efficient and reliable process. Additionally, the optional features such as the programmable operating profiles and networkability provide an even higher level of flexibility and performance.