Used ASM IS898DA #9363022 for sale

ASM IS898DA is an automated bonding equipment developed by ASM Pacific Technology, an industrial automation solutions provider. It is designed for use in the manufacture of semiconductor packages, including flip chip packages and wire bonds. The system combines smart software with a particle-controlled robotic arm to precisely dispense and apply a wide range of adhesive materials onto a semiconductor package. This results in improved speed and accuracy in the bonding process. The unit is designed to be used in conjunction with ASM optical inspection machine, which gives the operator real-time visual feedback on the process. This ensures that the bonding process is accurate and compliant with industry standards. The tool also incorporates a predictive maintenance asset to alert operators in the event of any potential issues before they arise, allowing for swift corrective action. IS898DA robotic arm is a 3-axis linear motor driven device with a maximum speed of 5m/minute and a maximum acceleration of 10m/s2. This allows for precise, fast and repeatable dispensing of a range of adhesive materials, delivering a highly repeatable process. The model also features backlash-free servo drives, ensuring high precision in the dispensing stroke. To achieve this accuracy, the robot arm is equipped with an advanced force/torque sensor that monitors the force exerted during each dispensing cycle. ASM IS898DA is designed for use in a cleanroom environment, and is compliant with the relevant ISO standards. It also features a number of safety features to ensure the safety of the operator during operation. This includes a light curtain to ensure that the operator stays out of harm's way during the bonding process. Additionally, the equipment can be integrated with a range of software solutions for managing data, real-time formulation and compliance information, enabling operators to track and adjust the bonding process in real time. This allows for complete process control and optimization. Overall, IS898DA is a highly capable and reliable bonding system that provides reliable, high-precision bonding of semiconductor packages, ensuring defect-free results. Its advanced monitoring and predictive maintenance features also make it a safe and reliable option for cleanroom environments.