Used ASM IS898GA #9401815 for sale

ASM IS898GA is a high performance double-loop, automated wedge bonder from ASM America that is perfectly suited for small package sizes. This state-of-the-art device can bond fine in-line wires, small surface mount and flip-chip components such as dice, BGAs and CSPs, as well as SIPs, BOCs and fine lead frames. Its advanced laser height measurement equipment eliminates the need for height calibration, allowing users to achieve consistent bonds without supervision. IS898GA's intuitive graphical graphical user interface (GUI) provides easy access to all functions, allowing users to quickly and accurately configure boding speeds and parameters. Users can also access pre-defined programs and recipes within the system, allowing them to quickly set up the bonder and maintain quality production. The unit also allows users to save their own recipes and programs remotely to maintain a consistent program library and prevent code loss. ASM IS898GA is equipped with dual loop wedge technology, enabling simultaneous bonding on both sides of the package. This makes it suitable for a wide range of applications, including stacked die components, RFID chips, curved packages, and wiring substrates. With its improved bondability, low loop height adjustment and low pressure bonding, IS898GA is capable of forming high-tie strength bonds faster and more accurately than ever before. ASM IS898GA is equipped with an advanced vision machine that automatically locates the die on the substrate and aligns the wedged side for optimal bonding. With its flexible programmable camera, IS898GA can be used to align a variety of substrates with accuracy and repeatability. The tool is capable of handling various package sizes ranging from 0.5mm x 0.5mm in die attach to 8mm x 8mm in SMD attachment. In addition, ASM IS898GA is designed to meet the latest international safety and environmental standards and is RoHS compliant. It is also designed with automated resetting, allowing users to reset the bonder repeatedly without resetting the entire asset. With its robust design, high-quality components and reliable performance, IS898GA is an industry benchmark in automated bonding.