Used ASM IS898GA #9401816 for sale

ASM IS898GA is a high speed, high precision robotic bonder used for die bonding and wire bonding operations. As one of the few commercial bonders that is capable of simultaneous bonder operation, IS898GA is an ideal machine for manufacturers who need to operate multiple production lines at the same time. For die bonding, ASM IS898GA uses a combination of a die pressure head, die holder, and alignment ring to accurately position the die to the substrate, while a temperature-controlled pneumatic press attaches the die at low pressure. The bonding heads have a very low profile, which minimizes disturbance to the vicinity of the die and helps reduce particle contamination. Additionally, IS898GA has an automated die-picking system that allows it to quickly retrieve and integrate new dies into the production line. For wire bonding, ASM IS898GA is equipped with an integrated wire feeding system and a heated wedge bond head. This combination allows for simultaneous feeding and bonding operations, reducing cycle times and improving productivity. IS898GA also has a three-axis independent vector drive that can quickly realign wire binding paths, allowing for accurate and repeatable performance. ASM IS898GA is also extremely easy to maintain and operate. Its programmable parameters simplify the setup process for chip placement and wire bonding applications, and its real-time data monitoring functions ensure precise process controls and reduce downtime. In addition, the machine features an ergonomic design that ensures operator comfort, and its advanced safety features help prevent potential accidents. IS898GA was designed to meet the needs of today's demanding die bonding and wire bonding operations, with its advanced technology and precise performance. Collectively, these features make ASM IS898GA an ideal solution for industrial and consumer electronic manufacturers.