Used ASM ISLBE 139H #293600585 for sale

ASM ISLBE 139H is an advanced cost-effective manual die bonder designed for industrial and Laboratory applications. The system is capable of bonding a variety of materials, including semiconductor chips and passive components, with a vast selection of materials and techniques. It is a robust, reliable and accurate bonder with integrated optical and electrical testing capabilities, featuring three available vision systems with up to four cameras and up to two metrology stages. ISLBE 139H uses two main bond techniques, thermocompression and thermosonic. Thermocompression bonds are formed using a solder pre-form or wire, combined with the controlled and consistent application of heat and pressure. The thermosonic process forms bonds by melting the melting point lower materials, using the acoustic vibration of an ultrasonic transducer and adding a flux to reduce oxidation. The temperature and vibration power are adjustable to accommodate various material combinations. The bonder is also equipped with standard needle modules and a variety of optional attachment and looking heads to accommodate a wide range of different material types and applications. The active parameters of each process can be precisely controlled, providing enhanced process repeatability and stability. With ASM ISLBE 139H, bonded components can be inspected optically and electrically before, during and after bonding. The cameras and optics systems are designed to detect defects in solder paste, wire and pre-form, as well as detecting short, open and misalignment defects. ISLBE 139H offers a comprehensive software package for programming and job set-up, allowing users to quickly and easily set up and operate the bonder to produce consistent and highly reliable bonds. The software includes vision tools for registration and alignment, as well as powerful tools for process parameter adjustment and options for statistical process control. The system is also equipped with tools for 3-dimensional die placement accuracy and repeatability verification, allowing users to quickly and precisely create highly reliable components. ASM ISLEE 139H offers the perfect combination of control, accuracy and reliability for semiconductor bonding and related applications. Its powerful and advanced features, combined with its comprehensive software package, put it in a class of its own in the highly advanced and competitive manual die bonder market.