Used ASM ISLINDA #293649798 for sale

ASM ISLINDA
Manufacturer
ASM
Model
ISLINDA
ID: 293649798
Wafer Size: 6"-12"
Die bonders, 6"-12" 2014-2017 vintage.
ASM ISLINDA is a bonder manufactured by ASM International, a leading manufacturer of automation equipment. This collimated point-source bonder provides a reliable, repeatable, low-cost bonding process using thermocompression, energy input, and laser processes. It features a highly reliable, low-cost manual bonding design with an integrated vision equipment, an adjustable heating element, and a variety of standard features designed to meet the accuracy and throughput requirements of a variety of applications. ISLINDA bonder is designed to bond a wide range of components, including ICs, chip carriers, lead frames, and hybrid/MCM assemblies. This system is also appropriate for a variety of applications such as flip-chip mounting, die attach, and BGA rework. The bonder's integrated vision unit is capable of performing fiducial and site recognition, as well as barcode reading, on the component prior to bonding. This makes it easier to accurately place components and minimize misalignment issues. The machine features an adjustable temperature control temperature range of 100-450°C (212-842°F), adjustable time control settings, a dual stage uncollimating tool, and an extensive suite of monitoring and control functions. Additionally, ASM ISLINDA has a comprehensive alarm asset to alert the operator of any irregularities or malfunctions. ISLINDA is a powerful bonder that can be used for a variety of applications and offers a high degree of process control and accuracy. The model has an intuitive user interface, which allows for easy setup and operation. Furthermore, the equipment is equipped with a large number of safety features such as automatic shut off and remote locking capabilities, which ensure process safety and operator safety. Overall, ASM ISLINDA is an reliable, low-cost bonder with a wide range of capabilities that enable it to meet the accuracy and throughput requirements of many manufacturing processes. It is a perfect solution for a wide range of electronic component bonding applications and will ensure reliable, consistent results.
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