Used ASM ISLINDA #9234294 for sale

ASM ISLINDA is a fully integrated software package that provides automated production of integrated circuit (IC) packages. It combines three stages of the IC packaging process into one solution: die bonder, molding, and ion implanter. This package is designed to give IC manufacturers the flexibility and scalability they need to achieve high yields during the production process. ISLINDA die bonder provides a dedicated die attach equipment that transfers die to die and die to substrate. It uses a patented mechanism to pick, orient, and place die on the substrate accurately and quickly. The device includes a vision system to inspect die prior to placement as well as an array of probes to establish die position and connection quality. ASM ISLINDA molding unit encapsulates IC cells within a thin encapsulating material. This encapsulating material protects the fragile IC cells from environmental damage. It is applied onto the IC substrate in a highly precise manner making sure that all the IC cells are properly exposed to the test and measurement process. The machine comes with an array of advanced features such as embedding, fine-feature control, and automation support. Finally, ISLINDA ion implanter provides integrated packages with a complete doping process. Through this doping process, a controlled blast of ions is provided to alter the electrical characteristics of the IC device, allowing it to perform at optimal efficiency. The ion implanter has a wide range of features such as automatic loading, fine-tuning of implantation energies, and focused implantation control. In conclusion, ASM ISLINDA is a powerful integrated package that provides a versatile, scalable, and reliable way to produce technically advanced IC packages. The device allows manufacturers to achieve high yields during the production process while also providing a number of advanced features to ensure the highest quality output.