Used ASM ISLINDA #9401805 for sale
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ASM ISLINDA is an industrial high speed bonder machine specifically designed for the production of electronic components such as capacitors and resistors. The device is automated and can bond surfaces with varying complexities. With its high accuracy and superior thermal control, it is the perfect solution for high precision manufacturing of precision components. The benefit of this machine is its fast and efficient work available from the high speed production. Highly detailed results are created due to the high temperature and pressure used for bonding, with a maximum bond temperature of over 300°C. The machine is also equipped with an automatic component locating equipment to ensure accurate component placement. ISLINDA uses a patented inertia beam technology to ensure smooth operation. Thanks to this technology, the bonder can work with the utmost precision while maintaining excellent thermal stability and speed. In addition, its thermal management system (TMS) keeps a constant temperature across the bonder area to avoid any warping and misalignments. In addition to its superior thermal control, ASM ISLINDA features fast and efficient bonding processes due to its dust-free design which eliminates any chances of component contamination. An automated component locator unit allows a user to identify the exact component needed for the bonding process. This machine includes an array of sensors which is capable of identifying component shapes, sizes and materials to deliver an accurate bond. ISLINDA also comes with a wide selection of customizable settings to accomodate different production requirements. With its interface, users can select the required vacuum-type, bond pressure, temperature, speed and acceleration. Overall, ASM ISLINDA is a powerful automated bonding machine which offers superior thermal control and speed. With its automated component recognition tool, dust-free design and customizable settings, it is the perfect solution for high precision bonding of components.
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