Used ASM ISLINDA #9401806 for sale

ASM ISLINDA
Manufacturer
ASM
Model
ISLINDA
ID: 9401806
Vintage: 2016
Die bonder 2016 vintage.
ASM ISLINDA is a bonder designed for high-speed production of electronic components. It is a fully automated equipment featuring the capacity to feed film tapes and automatically detect and eject completed components to reduce cycle times. Its outstanding features include integrated hermetically sealed vacuum chambers and temperature-controlled thermal cycle chambers to enhance its reliability and minimize failure risks. ISLINDA bonder features ability to bond not just wires, but also ribbon cables and flexible circuits. It can automatically compensate for voltage drop caused due to resistance in ultrathin boards, and supports wire and ribbon up to 150 microns. It also ships with a user-friendly programming and monitoring system to accommodate more complex applications. The high-resolution vision inspection feature is a significant distinguishing factor of ASM ISLINDA bonder. Specifically engineered to identify defects in high-density, low-profile components, the vision unit enhances accuracy and performance, reducing the risk of rework and scrapping. ISLINDA bonder also features automated diagnostic systems. Its integrated test management machine allows users to monitor and collate logging of different test forms, results and data over the course of the production process. Furthermore, ASM ISLINDA bonder also supports an array of connectivity compared to traditional systems. It can easily integrate into manufacturing floors, as well as link to materials management systems, such as ERP. It also has a range of serialization options, out of the box, such as RFID tag, ID code and barcode indication, to ensure maximum traceability. Overall, ISLINDA bonder is designed to improve cycle times and reduce production times, as well as reduce material, energy and labor costs. Its intuitive design and high-precision engineering, combined with wide array of features and ability to connect to various systems, make it an ideal choice for any application that requires high-powered bonding capabilities.
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