Used ASM ISLINDA #9401807 for sale

ASM ISLINDA is a fully automated bonder designed for the rapid and reliable manufacturing of electronic devices with strong bonds. The main components of the bonder include the main control unit, high-precision weighing mechanism, bonding head, chip processing block, vision equipment, and bonder analysis module. The main control unit is responsible for controlling all the robots in the bonding system and consists of a multiprogrammed industrial computer, integrated communication systems, and software systems. The sub-modules are used to communicate with the machine and perform the various functions such as performing bond measurements, controlling the vision unit, and giving the operator an interactive Graphical User Interface. The sub-modules also support various programming languages, such as C++, Visual Basic, and Java. The bonder also features an advanced diagnostics functionality which makes it possible to detect and analyze any problems quickly and accurately. The high-precision weighing mechanism is used to accurately measure the bond parameters and detect irregularities in the process. The bonding head is used to apply the substances to the chips. It consists of a lightweight, high-pressure, and stable head mounted on an electrically driven base. With its high pressure, it ensures a uniformly secure bond, which is essential for reliable device manufacturing processes. It also has a high repeatability rate and is capable of a large number of single-step and multi-step bonding operations. The chip processing block is used to assemble the chips and allow them to be handled and tested in a uniform and cost-effective manner. The vision machine is used to inspect the chips and the bonder analysis module is used to provide quality control for the bonds. ISLINDA has been designed to be one of the easiest to use bonders in the industry and provides an excellent repeatability rate and reliability. The user-friendly graphical interface and advanced diagnostics functions make it a great choice for any automated bonding solution.