Used ASM Lotus-ePlus #293662724 for sale

ASM Lotus-ePlus is a high-performance, automated bonder for large-scale production of precision gold and silver wire bond assemblies. This versatile tool is designed for a wide range of application requirements, such as Power Packaging, Medical Devices, LED, Automotive, and Aerospace applications. Lotus-ePlus is capable of producing wafer level ultrasonic wire bonds, flip chip attach with sub-micron level accuracy and repeatability. The highly accurate ultrasonic bonding process can be programmed to produce single and double wire loops at high speed using automated algorithms that determine the position of each loop based on the product design characteristics. The bonder is robust and reliable, and offers a wide variety of features to maximize production throughput with minimal errors. The bonder features integrated vacuum feeder systems, multiple vision systems, and an advanced Teach-Control feature that allows for programming of product specific optimized bond processes. The automated work station also features a range of tools to scan and inspect each bond, ensuring that only the highest quality product is produced. ASM Lotus-ePlus is designed to be a cost effective solution for high volume production of precision gold and silver wire bonding assemblies. The machine can be programmed to scale between high-speed and high-precision to accommodate multiple production requirements. The bonding method is highly efficient, and able to deliver results with very low failure rates while providing the highest possible quality output. The automated process also enables easy and fast set up, and provides reliable repeatability for long production runs. Lotus-ePlus is designed for a variety of specialty applications and has been used successfully for several high-tech applications, including microprocessor packages, automotive electronics, medical devices, and LED assemblies. The system is easy to operate and maintain, and is compatible with multiple sizes and type of wire bonding materials. Overall, ASM Lotus-ePlus is an ideal solution for high-volume production of precision gold and silver wire bonding assemblies. It offers a highly efficient automated process for precision attach and bonding, with very low failure rates and high quality results. The machine is also cost effective, easy to use, and easy to maintain and is capable of meeting the demanding requirements of the most complex applications.