Used ASM Lotus-S #9378076 for sale

ASM Lotus-S is an advanced simultaneous bonding equipment that provides an automated and efficient solution for all forms of die-package and PCB connections. Lotus-S boasts a small form factor allowing flexibility in spatial configuration while also maintaining an impressive throughput capability. It is equipped with a high degree of repeatability and extremely precise micro-adjustment capabilities that ensure extremely precise connections. This is particularly beneficial when working with precise components such as RFID tags and smart tags. The system is equipped with a powerful assembly solution through the use of two PLC-controlled robots with synchronized air jetting capabilities. The robots can be controlled independently or in tandem for the tightest of assemblies. This is further enhanced by the integration of ASML's patented pressure bar technology. This technology ensures uniform pressure distribution through the application of a constant pressure force on each component. This not only ensures strong connection integrity, but it also reduces the risk of overall failure. To further enhance connection strength and reliability, ASM Lotus-S offers the flexibility of no-clean controlled die-attach fluxing, an integrated pressure sensor, and a diode-based heater control unit. The fluxing machine helps ensure superior wire bonding reliability through precise flux application and deposition. The pressure sensor guarantees uniform pressure distribution to ensure a reliable connection and the diode-based heater control tool assures precise temperature control. Lotus-S boasts a high level of accuracy by providing a repeatable micro-alignment asset with 6 µm of accuracy and resolution. This allows for the accurate placement of the component and offers extremely reliable connections even at the highest of frequencies. ASM Lotus-S is an outstanding model that offers an automated solution for all types of die-package and PCB connections. It is equipped with powerful assembly capabilities and its precision design and accuracy will ensure your connection integrity and reliability. Additionally, its small form factor and high throughput allow it to be used in any spatial configuration with ease.