Used ASM MCM12 #293591440 for sale

ASM MCM12 is a bonder designed to provide reliable and consistent performance in the production of assembled microchips and bonded wafers. It is widely used to automate wafer bonding processes in the manufacture of electronic devices, such as integrated circuits. What makes ASM MCM 12 unique is its ability to meet the highest demands of the industry for precision and accuracy. The equipment uses state-of-the-art technology to ensure accurate and reliable bonding of microchips and wafers. It is equipped with advanced features such as high-resolution image capture and edge alignment control. This provides a high-quality bond with superior mechanical strength and a precise profile. MCM12 integrates several key components including, sophisticated imaging components, specialized control system, and a high-precision wafer alignment unit. The machine utilizes a computer-controlled, double-sided binding process to ensure the highest bonding quality. This ensures a precise contact area between the bonder and the wafer, leading to an improved bond strength. Additionally, the tool is equipped with an integrated dual-sided wafer alignment asset, which is capable of verifying the correct position of wafers before the bonding process. This helps to eliminate any problems or defects associated with misalignment of wafers. Furthermore, the model also has a built-in imaging equipment that provides real-time feedback regarding the bonding process and identifies any potential defects. MCM 12 is easy to operate and ideal for use in small, medium and large-scale production. It is designed to meet the production requirements of any size, allowing for fast and efficient operation of the device. With its reliable performance and advanced features, ASM MCM12 is an ideal solution for efficient and accurate wafer bonding.