Used ASM MCM12 #293610604 for sale

ASM MCM12 is a high-performance, thermally-controlled bonder manufactured by ASM Pacific Technology, Ltd. It is a full-fledged bonding platform suitable for both small and large die assembly sizes, offering multiple process capabilities such as wafer-level and die-level flip-chip and FC-eutectic bonding, Cu pillar, and full-die-level C4/C5/ wirebonding. Using a fully-automated process that utilizes force and thermal control, ASM MCM 12 can be successfully used in both prototyping and high-volume production roles for various semiconductor-based materials. MCM12 features a motion platform with a six-axis motion capability, allowing for a high degree of precision and precise alignment with the target pads. In addition, MCM 12 can be equipped with a variety of optics options, such as LED light sources and digital cameras, to aid in precise alignment, leading to more precise and consistent results. ASM MCM12 bonder also uses several types of heating elements, providing a precise temperature profile to the die and surrounding substrate to ensure proper assembly. The bonder is equipped with an alignment system and either a direct-sensing force feedback or an indirect force sensing technology, which allows the user to control the force applied to the die so that it remains within ASM-recommended tolerances throughout the bonding process. ASM MCM 12 also features a power package for converting AC/DC power for the bonder functions, providing both bias and ground stabilization. Additionally, the power package is designed with safety features, such as overload protection and temperature control, to ensure a safe working environment. MCM12 is designed to be robust and reliable, providing repeatable results with its state-of-the-art controllers. The bonder can easily be integrated into existing production lines, and the real-time monitoring system allows for continuous quality control and optimization. All in all, MCM 12 is an ideal bonder for producing high-quality, high-performance products.