Used ASM MCM12 #9137827 for sale

Name: ASM MCM12
Brand: ASM
SKU: 9137827
Availability: SoldOut

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

Tap to zoom

Sold

Bonders

Manufacturer

ASM

Model

MCM12

ID: 9137827

Wafer Size: 12"

Multi-Chip mounting machine, 12" Substrate type: BGA, boat, ceramic, flex substrate, FR4, leadframe, wafer Direct die bonding High precision die bonding Flux dispensing / dipping flip chip bonding SMD bonding Wafer to wafer bonding Thin die bonding XY placement: +/-25um @3 sigma (Die bond) Die rotation: +/- deg @3 sigma (Die bond) Die size: 0.15x0.15 to 50*50mm (Die bond) Wafer: Die size (Die attach): 0.15 to 50mm Die size (Flip-chip): 0.8 to 50mm Die thickness: 0.1 to 5mm Chip tray: Waffle pak gel pak: 2" 3" & 4" Die thickness: 0.1 to 5mm Process material handler: Dispenser: Type: Time-Pressure, Auger pump Cartridge size: 5cc, lOcc, & 30cc Filling level control: Sensor Slide Fluxer: Flux film thickness: 20 to 150 µm Flux film evenness: ±3 µm Viscosity range: 2,800 to 110,000 cps (6) Tool changer Component handler: Bond-Head: Die attach bond arm Bond force: Up to 400gf (3kg with Cylinder) Bond force Control : Voice coil + Cylinder + Micro-E encoder Pick force: 30 to 400gf Z-Travel: BH 110mm; EW 30mm Rotation: ±180° Rotation resolution : 0.022° Rotation repeatability: ±0 06° Flip-Chip unit: Pick force: 50 to 300gf Z-Travel: 5mm Resolution: 0.2 µm Rotation: 180° Wafer table Standard Option XY Travel 320 X 320mm 320 X 320mm Expansion Programmable Zero, 5mm, 10mm Max 15mm Rotation 360° Nil Conversion <10 min <10 min Configured to work with magazines.

Read More Close

ASM MCM12 is an optically transparent wafer bonder designed to permanently join two substrates together. It uses an optical alignment system to align the top and bottom substrates, and then applies pressure to drive the bonding process. The bonder is designed to be extremely precise, capable of joining substrates down to nanoscale precision. ASM MCM 12 bonder uses epoxy as its bonding agent, allowing for strong and permanent connections between the two substrates. The epoxy is spread over the substrate during the bonding process, ensuring complete coverage for maximum strength. The bonder is designed to withstand temperatures up to a maximum of 350°C, allowing for a range of different bonding processes to be carried out. MCM12 bonder is specially designed for use with wafers, but can also join substrates of other shapes. It is fitted with an automated wafer lift, allowing for easy handling of thick wafers and substrates with irregular surfaces. The bonder is also highly automated, with automatic substrate alignment and bonding processes making it easy and efficient to use. MCM 12 bonder is provided with a variety of tools, allowing for a range of different bonding processes and applications. It comes with an alignment mirror and a wafer lifting device, allowing for precise placement of the wafers on the bonder. The bonder also comes equipped with an automated epoxy dispensing system, ensuring precise coverage of the substrates and ensuring the highest quality bonds. Overall, ASM MCM12 is an optically transparent wafer bonder designed for the highest precision and most accurate bonding process. It is equipped with a range of features to make its use efficient and reliable, while also providing a range of tools to ensure a variety of bonding processes and applications. The bonder is designed to handle temperatures up to 350°C, allowing it to be used in a wide variety of settings.