Used ASM Twin Eagle 60 #293591557 for sale
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ASM Twin Eagle 60 Bonder is a highly advanced electronic component assembly equipment. It uses a computer-controlled, precision digital bonder to accurately attach terminals, leads and other conductive elements to boards and assemblies. The system is designed to meet the demands of high-volume component assembly, providing fault-free, repeatable placement and bond performance. Twin Eagle 60 consists of a worktable with an automatic component feeder and component placement head, a control console, and a heated bonder. The control console includes a user-friendly touch-screen interface to manage all machine functions and downloads of components for placement. The bonder is capable of handling a variety of substrates ranging from ceramic substrates to polymers. The Twins Eagle 60 is designed for flexibility and features wide placement accuracy of up to 0.2mm, and placement speed of up to 400 parts per minute. The bonder is designed to deliver precise and repeatable performance, with temperature delta accuracy of up to 0.2%. The unit also features conveniently small footprint, making it versatile and suitable for a variety of production environments. ASM Twin Eagle 60 has a set of high-level safety features that prevent errors and ensure the safety of operators. The machine features two modes of fine adjustment in X and Y directions, three failure detection modes, and an emergency stop function. Additionally, the tool has an ASP over-temperature prevention asset and a built-in laser for high accuracy positioning. Twin Eagle 60 is compliant with the ESD standard IEC 61340-5-1 and can be used to assemble components from BGA, CSP, and QFP packages. Its advanced monitoring and control systems are designed for zero-defect production. Components and glue cartridge load precisely, and finished parts can be unloaded quickly and accurately. In conclusion, ASM Twin Eagle 60 Bonder is an impressive automated component assembly model suitable for high-volume production. Its accurate and repeatable placement and bond performance make it an ideal solution for the efficient and economic production of high-volume solutions.
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