Used ASM Twin Eagle Xtreme #293671965 for sale

ASM Twin Eagle Xtreme is a state-of-the-art bonder designed to facilitate the joining of two materials such as a substrate and a foil. It is the perfect tool for when high precision is required, and it is suitable for a range of substrates and thicknesses. The bonder has been designed with the user in mind, making it one of the most user-friendly bonders on the market. The Xtreme is designed with a large wafer chuck, allowing it to bond a range of wafer sizes. It has a number of user-defined parameters that can be adjusted for specific applications, such as wafer size, pressure, and time, to ensure that each process step is reproducible. The Xtreme is able to achieve uniform performing bonds across the entire surface of the substrates due to its patented blanket bonding technology. This makes it perfect for use in a range of high-volume manufacturing processes. In addition, the machine's twin plasma torches are designed to bond materials quickly and efficiently, ensuring that the entire bonding process is highly productive. The Xtreme is also fitted with the latest safety features to ensure that operators can work safely when using it. These features include automatic shut-off and overload protection if the machine is operated incorrectly. Twin Eagle Xtreme also offers a variety of optional upgrades, including an optional thermal control module for precise temperature control. This feature allows the bonder to be used in a variety of environments, including high heat and extreme temperature conditions. This ensures that the bonding process is always kept uniform and reliable. ASM Twin Eagle Xtreme is the ideal choice for those requiring precision bonding solutions. Its advanced features and user-defined parameters make it perfect for use in a range of high-volume manufacturing processes, ensuring that the bond is always of the highest quality. The addition of safety features and optional thermal control modules make this bonder a safe and reliable choice for users that require a reliable and reproducible bonding process.