Used ASM Twin Eagle #293591559 for sale

ASM Twin Eagle is a bonder designed for high-precision die bonding, perfect for small advanced IC packages. The machine is engineered with advanced digital servo motors and custom controllers, allowing for precise and extremely accurate die bonding. Its large, servo-controlled bonding head features an integrated needle array, allowing it to accommodate a wide range of advanced die sizes and shapes, enabling it to bond on even the most intricate devices. Twin Eagle includes multiple modes of operation, allowing it to benefit any application. Its manual mode is ideal for test or prototype applications, allowing the user to manually control the speed, pressure and optical position of the part-to-die assembly. Its automatic mode has a range of pre-programmed bonding parameters which can be used for quick selection of the most efficient and reliable bond process, perfect for mass production applications. The machine is fitted with vision systems with both optical alignment and inspection functions, enabling automated die placement control with an accuracy of up to 0.5 micrometers. The die bonder also features an integrated active vision system with a high-fidelity 3D reconstruction capability, allowing it to generate virtual test samples in order to quickly detect bond defects. ASM Twin Eagle's high-volume throughput and reliability make it ideal for manufacturing process control and cost-effective die bonding. Its advanced digital servo motion controllers enable the machine to operate at low temperatures, extending its operational life and saving energy. In addition, the dual-infrared heating system allows for more accurate temperature control and faster bond cycle times. The bonder is backed by an intuitive programming and monitoring software suite, making it easy to modify process parameters, as well as to monitor bond progress and status. The user-friendly handling system of Twin Eagle simplifies automated loading and unloading of both components and dies, further increasing throughput. The machine's advanced technology and robust design make it a perfect choice for high-precision die bonding of advanced IC packages, ensuring maximum productivity and precision. With its intuitive software suite, automated loading and unloading, vision systems and advanced digital servo controllers, ASM Twin Eagle is the perfect solution for mass production applications.