Used ASM Twin Eagle #293651722 for sale

ASM Twin Eagle is a high-level, precision bonder developed by Advanced Semiconductor Materials (ASM) for wafer and die attaching applications. It is equipped with a 5-axis direct drive arm for precise positioning and a vacuum blade preforms excellent flips, ensuring accurate flip and precision orientation control. Twin Eagle features a high-resolution color Camera system and die-to-die registration with superior accuracy & repeatability. Apart from that, its impeccable Vision Manager software includes features like auto-teach, jog teach, auto-recognition of dies, wafers, and pins, etc. It also helps in automatic alignment and correction of the die positions. ASM Twin Eagle also allows for placement of die with aspect-ratios up to 12:1 and a vacuum tweezer support with a dual chuck system, helping to keep the delicate components safe during increased force applications. Besides, its high-speed Z-hinge allows for accurate precision motion control and can flip die up to 3 mm thickness. Moreover, its advanced controller hardware utilizes a OpenTraxTM technology, which supports sophisticated recipes including wafer mapping. Twin Eagle also provides an intuitive Operator Interface with its brilliant WYSIWYG (What You See Is What You Get) design tool featuring a customizable cartesian coordinate system, aiding in easy and fast operation. Overall, this machine is excellent for various applications like flip chip devices. Solder Balls, paste dispensing, etc. It helps to reduce wafer-level packaging time; enabling higher yields and superior quality with its remarkable precision and accuracy. ASM Twin Eagle is the perfect choice for advanced wafer-level die attach and chip bonding needs.