Used ASM Twin Eagle #9266363 for sale

ASM Twin Eagle
Manufacturer
ASM
Model
Twin Eagle
ID: 9266363
Wire bonder.
ASM Twin Eagle is a fully automated bonder designed for advanced copper bonding applications. It features dual-arm flexibility and an easy-to-use interface, allowing manufacturers to achieve greater accuracy and throughput in their production lines. The device is capable of performing various types of micro joint interconnections, such as wire-to-die, wire-to-substrate, and die-to-substrate, as well as large area copper connections. Twin Eagle is designed with advanced vision, control, and motion features, which allow manufacturers to achieve superior levels of accuracy and reliability in their interconnections. The device comes with proprietary software that allows the user to calibrate parameters for the most precise process control. An integrated vision system can inspect each bond prior to testing, ensuring repeatable accuracy and repeatability. ASM Twin Eagle features a high-speed, precision alignment controller and can accommodate a wide variety of substrates and interconnects. It also has a multi-zone oven to perform mobile heated bonding steps. Additionally, it's possible to mount the bonder and multiple tooling and optimization strategies for custom processing needs. The device uses advanced high-speed image processing algorithms to identify the details of the bond for precision and repeatability. The integrated vision system features an advanced LED lighting system, which can be used to accurately identify bond features and enable reliable optimization of the bonding process. Twin Eagle can also be integrated with several tooling and a variety of programming languages. This combination of features makes it an ideal choice for manufacturers who are looking to achieve superior production levels and increased accuracy in their interconnections. Additionally, the device is backed by a full-service, on-site engineering and support team. ASM Twin Eagle is an ideal choice for advanced copper wiring bonding applications.
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