Used ASM XK 25-298 #9179839 for sale

ASM XK 25-298 is a high-performance, semi-automatic wire and ribbon bonder. This device is ideal for general-purpose wire and ribbon bonding applications such as chip-on-board, flip-chip, leadframe, and ribbon cable interconnect packaging. This product is simple to use and easy to maintain and offers excellent performance. XK 25-298 is composed of six main components including a stationary dual-axis articulating arm, a drive equipment, an alignment system, a thermal heater, a bonding head, and a console. The articulating arm can be raised and lowered as needed and offers a tall working range of up to 17 inches. The drive unit is responsible for the smooth and precise isatafrom movement of the arm in all directions. The alignment machine ensures a perfect bond every time and offers precision ± 0.0004 inches for wire and ± 0.001 inches for ribbon. The console helps to manage the operation of the device with a graphical user interface. The thermal heater provides a working temperature of up to 450°C for heat-activated bonding. This ensures consistent results for a variety of materials. The bonding head has two available configurations, a dual head and a single head, capable of handling .001 to .004 inch diameter wires. The dual head is designed for bonding ribbons and offers an adjustable temperature range of 0°C to 350°C. ASM XK 25-298 is an excellent choice for any wire and cable interconnect packaging application. This device offers consistent and reliable performance and is easy to maintain. It is ideal for a wide variety of bonding materials and is highly flexible for industrial applications. With the latest advancements in accuracy and thermal process control, XK 25-298 is the ideal choice for a productive and reliable production cycle.