Used AST / ADVANCED SYSTEM TECHNOLOGY B220A #9384506 for sale

AST / ADVANCED Equipment TECHNOLOGY B220A is a tool utilized in the semiconductor industry for wire bonding applications. This robust and reliable tool has been designed to handle large-scale production of high-reliability assemblies and components with increased versatility. The primary function of AST B220A is to use a thermal process to join two leads of a semiconductor device together. This is achieved through the use of a thermocouple placed on the bonder's palette or heat plate. The heat produced from the thermocouple is transferred to the bonding site via an ultrasonic bonding head. This process causes the metal on the bond pads to melt and fuse together, forming a strong electrical connection. ADVANCED System TECHNOLOGY B220A also utilizes a number of other advanced features in order to achieve utmost performance. A Pulse Form and Frequency Control (PFFC) unit enables enhanced bonding accuracy by providing precise control over the pulse and frequency of the ultrasonic vibration. Additionally, B220A features the X-Y Drive Mechanism and Position Lock, which allows for precise alignment and secure joining of components. In addition, AST / ADVANCED Machine TECHNOLOGY B220A provides an improved safety feature for the operator. Its new sensor-based systems detect any movement or obstruction of any particular bond point, hence helping to prevent undesired wire looping or arc formation. AST B220A's hot-melt bonding option is extremely intuitive to use and requires virtually no operator intervention. To ensure optimal bonding performance, ADVANCED Tool TECHNOLOGY B220A includes a state-of-the-art vision asset that monitors the bonding process. This is complemented by an advanced closed-loop model that aids in achieving utmost accuracy and repeatability. Furthermore, B220A offers a wide range of bonding scenarios. In concluding, AST / ADVANCED Equipment TECHNOLOGY B220A is a robust and reliable tool that is designed to handle large-scale production of high-reliability semiconductor assemblies and components with increased versatility. This tool is equipped with advanced features that provide precision and control over the bonding process, along with enhanced safety measures for the operator. It also includes a vision system that monitors the bond for utmost accuracy, along with a wide range of bonding scenarios available to the user.