Used BREWER SCIENCE 1300CSX #293656541 for sale

BREWER SCIENCE 1300CSX
Manufacturer
BREWER SCIENCE
Model
1300CSX
ID: 293656541
Thermal debonder.
BREWER SCIENCE 1300CSX is a wafer bonding equipment for temporary bonding and debonding of silicon wafers and other substrates. The system is available in either manual or automatic configurations, both of which are designed to provide high accuracy and consistent bond quality. 1300CSX features an automated wafer alignment unit with a precision of ± 10 µm in a single-axis. The machine is capable of measuring and compensating for bow and twist in the wafer as it is brought into contact. This eliminates the need for manual alignment of the wafers and provides repeatable alignment accuracy. The tool also has an integrated process monitoring asset that provides feedback on variables such as temperature, force, alignment, and displacement. The model is designed with a high-temperature diffusion bonding process that allows for bonding temperatures up to 850°C. This makes it suitable for a variety of applications and materials, including thermoplastics, glass frit, and metals. It is also equipped with a three-dimensional wafer handling mechanism that allows for accurate placement of bonded substrates onto the chuck. BREWER SCIENCE 1300CSX is equipped with a variety of process tools to improve accuracy and throughput. These include a quick-change chuck equipment, automated vision system, high-level thermal process control, and a dynamic species control. The unit is designed for throughputs up to 1 wafer per second, and features a variety of pre-set recipes to simplify process development. The machine also offers a variety of safety measures to ensure the safety and well-being of the user and other personnel, including an interlocking safety gate tool, a safety curtain, and an oxygen monitor. A number of data output options are available to allow for process control, logging, and process optimization. 1300CSX is well suited for medium and high-volume production of wafer bonding and debonding applications in semiconductor and MEMS devices. The asset is easy to use, offers precise process control, and provides reliable process results.
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